Publication:

Testing TSV-based three-dimensional stacked ICs

Date

2010-03
Proceedings Paper
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-5058-8303
cris.virtualsource.department8a303854-e9b4-460a-b79d-03df3b3c4394
cris.virtualsource.orcid8a303854-e9b4-460a-b79d-03df3b3c4394
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2021-10-18T18:48:53Z
dc.date.available2021-10-18T18:48:53Z
dc.date.embargo9999-12-31
dc.date.issued2010-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17579
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5457087
dc.source.beginpage1689
dc.source.conferenceDesign, Automation, and Test in Europe Conference - DATE
dc.source.conferencedate9/03/2010
dc.source.conferencelocationDresden Germany
dc.source.endpage1694
dc.title

Testing TSV-based three-dimensional stacked ICs

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
20047.pdf
Size:
321.54 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions