Publication:

Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability

Date

2023
Journal article
https://doi.org/10.1007/s11837-023-06015-x
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cris.virtual.orcid0000-0002-9257-6837
cris.virtual.orcid0000-0002-6098-8618
cris.virtual.orcid0000-0002-3096-050X
cris.virtual.orcid0000-0002-2526-3873
cris.virtual.orcid0000-0003-0578-3422
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cris.virtualsource.orcid06dee884-43a4-47f4-bf03-475b62e797ba
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dc.contributor.authorChery, Emmanuel
dc.contributor.authorBrady-Boyd, Anita
dc.contributor.authorBhatia, Ritwik
dc.contributor.authorPinho, Nelson
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorArmini, Silvia
dc.contributor.authorSundaram, Ganesh
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecPinho, Nelson::0000-0002-0701-5921
dc.date.accessioned2023-12-14T12:39:15Z
dc.date.available2023-09-03T17:38:58Z
dc.date.available2023-12-14T12:39:15Z
dc.date.embargo2024-02-15
dc.date.issued2023
dc.description.wosFundingTextThe authors would like to express their gratitude to the different imec teams involved in this study. Contributions from imec's 3D IIAP program are deeply acknowledged. Special thanks for the numerous FIB cross-section requests handled by Dr. Olivier Richard and Ms. Chris Drijbooms. Sincere thanks should go to JSR Corporation and JSR Micro N.V. for providing the photosensitive polymer used in this study. The support of A. Hiro and H. Noda is deeply recognized.
dc.identifier.doi10.1007/s11837-023-06015-x
dc.identifier.issn1047-4838
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42457
dc.publisherSPRINGER
dc.source.beginpage5096
dc.source.endpage5102
dc.source.issue12
dc.source.journalJOM
dc.source.numberofpages7
dc.source.volume75
dc.subject.keywordsGAS-DIFFUSION BARRIERS
dc.subject.keywordsCOPPER
dc.subject.keywordsAL2O3
dc.subject.keywordsDEPOSITION
dc.subject.keywordsENCAPSULATION
dc.subject.keywordsCORROSION
dc.subject.keywordsMETAL
dc.title

Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability

dc.typeJournal article
dspace.entity.typePublication
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