Publication:

Thermo mechanical challenges for processing and packaging stacked ultrathin wafers

Date

2013
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4374-4854
cris.virtual.orcid0000-0001-7778-0365
cris.virtual.orcid0000-0002-3096-050X
cris.virtual.orcid0000-0002-6878-7124
cris.virtual.orcid0000-0002-6753-6438
cris.virtualsource.departmentb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.departmenta31644a7-c9a3-498b-94f3-d192472b51ce
cris.virtualsource.department67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.department9156bc37-ce4f-400b-8108-5ac33a3650ac
cris.virtualsource.department0aefe159-9129-4bab-908e-3a73693ee2e4
cris.virtualsource.orcidb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.orcida31644a7-c9a3-498b-94f3-d192472b51ce
cris.virtualsource.orcid67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.orcid9156bc37-ce4f-400b-8108-5ac33a3650ac
cris.virtualsource.orcid0aefe159-9129-4bab-908e-3a73693ee2e4
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T07:55:15Z
dc.date.available2021-10-21T07:55:15Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22413
dc.source.beginpage7
dc.source.conference63rd IEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage12
dc.title

Thermo mechanical challenges for processing and packaging stacked ultrathin wafers

dc.typeProceedings paper
dspace.entity.typePublication
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