Publication:

Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding

Date

2010
Proceedings Paper
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-4667-5092
cris.virtual.orcid0000-0003-0111-431X
cris.virtualsource.departmentb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.departmentba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
cris.virtualsource.orcidb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.orcidba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
dc.contributor.authorLamponi, M.
dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorPommereau, F.
dc.contributor.authorBrenot, R.
dc.contributor.authorde Valicourt, G.
dc.contributor.authorLelarge, F.
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorMessaoudene, S.
dc.contributor.authorFedeli, J.M.
dc.contributor.authorDuan, G.H.
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.date.accessioned2021-10-18T17:57:00Z
dc.date.available2021-10-18T17:57:00Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17427
dc.source.beginpage22
dc.source.conference7th IEEE International Conference on Group IV Photonics
dc.source.conferencedate1/09/2010
dc.source.conferencelocationBeijing China
dc.source.endpage24
dc.title

Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
21533.pdf
Size:
163.25 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions