In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Czarnecki, Piotr
dc.contributor.author	Kirimura, Tomoyuki
dc.contributor.author	Siew, Yong Kong
dc.contributor.author	De Wolf, Ingrid
dc.contributor.author	Boemmels, Juergen
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Croes, Kristof
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Czarnecki, Piotr
dc.contributor.imecauthor	Siew, Yong Kong
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.imecauthor	Boemmels, Juergen
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimec	Czarnecki, Piotr::0000-0002-3648-3046
dc.contributor.orcidimec	Boemmels, Juergen::0000-0002-8761-5213
dc.date.accessioned	2021-10-22T07:38:33Z
dc.date.available	2021-10-22T07:38:33Z
dc.date.issued	2014
dc.identifier.issn	0021-8979
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/24746
dc.identifier.url	http://scitation.aip.org/content/aip/journal/jap/115/7/10.1063/1.4866330
dc.source.beginpage	74305
dc.source.issue	7
dc.source.journal	Journal of Applied Physics
dc.source.volume	115
dc.title	In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
dc.type	Journal article
dspace.entity.type	Publication
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