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Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process
Publication:
Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process
Date
2000
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gao, Teng
;
Gray, William
;
Van Hove, Marleen
;
Struyf, Herbert
;
Meynen, Herman
;
Vanhaelemeersch, Serge
;
Maex, Karen
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2
since deposited on 2021-10-14
Acq. date: 2025-10-23
Views
1958
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Downloads
2
since deposited on 2021-10-14
Acq. date: 2025-10-23
Views
1958
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations