Publication:

Impact of backside process on high aspect ratio via-middle Cu through silicon via reliability

Date

2017-06

Proceedings Paper

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Files

34855.pdf 496.27 KB

Author(s)

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Van Huylenbroeck, Stefaan

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Stucchi, Michele

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Statistics

1792 since deposited on 2021-10-24

Acq. date: 2026-02-24