Publication:
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-4115-0075 | |
| cris.virtual.orcid | 0000-0002-6098-8618 | |
| cris.virtual.orcid | 0000-0002-6782-5424 | |
| cris.virtual.orcid | 0000-0002-6699-1615 | |
| cris.virtual.orcid | 0000-0001-7429-7570 | |
| cris.virtualsource.department | 319bcb05-51e0-4ebd-82cd-03314b82dce9 | |
| cris.virtualsource.department | 2d62ff30-6455-485f-882b-1ec067b6470c | |
| cris.virtualsource.department | 71656083-4e54-41a6-8b58-909e9d5aed91 | |
| cris.virtualsource.department | 12de27c7-869f-445c-8ac5-1dad7854aab4 | |
| cris.virtualsource.department | 07aba315-d17f-44ec-a8a8-d4fedf1a8b96 | |
| cris.virtualsource.orcid | 319bcb05-51e0-4ebd-82cd-03314b82dce9 | |
| cris.virtualsource.orcid | 2d62ff30-6455-485f-882b-1ec067b6470c | |
| cris.virtualsource.orcid | 71656083-4e54-41a6-8b58-909e9d5aed91 | |
| cris.virtualsource.orcid | 12de27c7-869f-445c-8ac5-1dad7854aab4 | |
| cris.virtualsource.orcid | 07aba315-d17f-44ec-a8a8-d4fedf1a8b96 | |
| dc.contributor.author | Yang, Liu | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | Honore, Mia | |
| dc.contributor.author | Stiers, Karen | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Vereecken, Philippe | |
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.imecauthor | Stiers, Karen | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.imecauthor | Vereecken, Philippe | |
| dc.contributor.imecauthor | Radisic, Alex | |
| dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
| dc.date.accessioned | 2021-10-23T17:29:23Z | |
| dc.date.available | 2021-10-23T17:29:23Z | |
| dc.date.issued | 2016 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27624 | |
| dc.identifier.url | http://ecst.ecsdl.org/content/72/4/145.abstract | |
| dc.source.beginpage | 145 | |
| dc.source.conference | Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 | |
| dc.source.conferencedate | 29/05/2016 | |
| dc.source.conferencelocation | San Diego, CA USA | |
| dc.source.endpage | 152 | |
| dc.title | Height uniformity of micro-bumps electroplated on thin Cu seed layers | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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