Publication:

Characterization of interconnects resulting from capillary die-to-substrate self-assembly

Date

2008
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-4645-3326
cris.virtualsource.department167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.orcid167f3fe9-5a33-4143-92b1-a1c815093eba
dc.contributor.authorMastrangeli, Massimo
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVan Hoof, Chris
dc.date.accessioned2021-10-17T08:53:26Z
dc.date.available2021-10-17T08:53:26Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14138
dc.source.beginpage135
dc.source.conference2nd Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate1/09/2008
dc.source.conferencelocationGreenwich UK
dc.source.endpage140
dc.title

Characterization of interconnects resulting from capillary die-to-substrate self-assembly

dc.typeProceedings paper
dspace.entity.typePublication
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