Publication:
Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications
| dc.contributor.author | Han, Yang | |
| dc.contributor.author | Dang Thi Thuy, Chi | |
| dc.contributor.author | Visker, Evert | |
| dc.contributor.author | Visker, Jakob | |
| dc.contributor.author | Humbert, Aurelie | |
| dc.contributor.author | Peng, Lan | |
| dc.contributor.imecauthor | Han, Yang | |
| dc.contributor.imecauthor | Dang Thi Thuy, Chi | |
| dc.contributor.imecauthor | Visker, Evert | |
| dc.contributor.imecauthor | Visker, Jakob | |
| dc.contributor.imecauthor | Humbert, Aurelie | |
| dc.contributor.imecauthor | Peng, Lan | |
| dc.contributor.orcidimec | Visker, Evert::0000-0002-1096-9670 | |
| dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
| dc.contributor.orcidimec | Humbert, Aurelie::0000-0002-2538-8991 | |
| dc.date.accessioned | 2023-01-19T15:08:41Z | |
| dc.date.available | 2022-09-24T02:50:53Z | |
| dc.date.available | 2023-01-19T15:08:41Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/LTB-3D53950.2021.9598407 | |
| dc.identifier.eisbn | 978-1-6654-0567-6 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40496 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 36 | |
| dc.source.conference | 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) | |
| dc.source.conferencedate | OCT 05-11, 2021 | |
| dc.source.conferencelocation | Nara, Japan | |
| dc.source.endpage | 36 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 1 | |
| dc.title | Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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