Publication:
Influence of alloying the copper supply layer on the retention of CBRAM
Date
| dc.contributor.author | Devulder, Wouter | |
| dc.contributor.author | Opsomer, Karl | |
| dc.contributor.author | Jurczak, Gosia | |
| dc.contributor.author | Goux, Ludovic | |
| dc.contributor.author | Detavernier, Christophe | |
| dc.contributor.imecauthor | Devulder, Wouter | |
| dc.contributor.imecauthor | Opsomer, Karl | |
| dc.contributor.imecauthor | Jurczak, Gosia | |
| dc.contributor.imecauthor | Goux, Ludovic | |
| dc.contributor.orcidimec | Devulder, Wouter::0000-0002-5156-0177 | |
| dc.contributor.orcidimec | Goux, Ludovic::0000-0002-1276-2278 | |
| dc.date.accessioned | 2021-10-22T19:00:52Z | |
| dc.date.available | 2021-10-22T19:00:52Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25199 | |
| dc.source.beginpage | 215 | |
| dc.source.conference | IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM | |
| dc.source.conferencedate | 18/05/2015 | |
| dc.source.conferencelocation | Grenoble France | |
| dc.source.endpage | 218 | |
| dc.title | Influence of alloying the copper supply layer on the retention of CBRAM | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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