Publication:
Excessive warpage of large packages during reflow soldering
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-6753-6438 | |
| cris.virtualsource.department | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| cris.virtualsource.orcid | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-19T20:41:17Z | |
| dc.date.available | 2021-10-19T20:41:17Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2011-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20016 | |
| dc.source.beginpage | 283 | |
| dc.source.book | The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead Free Solder Interconnects | |
| dc.source.endpage | 296 | |
| dc.title | Excessive warpage of large packages during reflow soldering | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |