Publication:

Atomic layer deposited barriers for copper interconnects

Date

2004
Meeting abstract
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dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorMartin Hoyas, Ana
dc.contributor.authorErnur, Didem
dc.contributor.authorTokei, Zsolt
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorSatta, Alessandra
dc.contributor.authorWhelan, Caroline
dc.contributor.authorShamiryan, Denis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorAbell, Thomas
dc.contributor.authorSutcliffe, Victor
dc.contributor.authorSchaekers, Marc
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.date.accessioned2021-10-15T16:07:51Z
dc.date.available2021-10-15T16:07:51Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9574
dc.source.beginpageTF-MoM1
dc.source.conferenceAVS 51 International Symposium
dc.source.conferencedate14/11/2004
dc.source.conferencelocationAnaheim, CA USA
dc.title

Atomic layer deposited barriers for copper interconnects

dc.typeMeeting abstract
dspace.entity.typePublication
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