Publication:

Optimization of die pick and place using BCB for 3D stacking

Date

2008
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorJourdain, Anne
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T07:54:36Z
dc.date.available2021-10-17T07:54:36Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13931
dc.source.conference13th Meeting of the Symposium on Polymers for Microelectronics
dc.source.conferencedate7/05/2008
dc.source.conferencelocationWilmington, DE USA
dc.title

Optimization of die pick and place using BCB for 3D stacking

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions