Publication:

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

Date

2023
Journal article
https://doi.org/10.1007/s12567-021-00403-2
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cris.virtual.orcid0000-0002-6413-998X
cris.virtual.orcid0000-0002-1867-827X
cris.virtual.orcid0000-0002-6753-6438
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cris.virtualsource.department8aa0c758-c770-49d7-bfd4-e80498e6e40b
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dc.contributor.authorCauwe, Maarten
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNawghane, Chinmay
dc.contributor.authorVan de Slyeke, Marnix
dc.contributor.authorCoulon, Alexia
dc.contributor.authorHeltzel, Stan
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.date.accessioned2023-08-02T09:23:25Z
dc.date.available2023-06-20T10:36:49Z
dc.date.available2023-08-02T09:23:25Z
dc.date.embargo2023-07-31
dc.date.issued2023
dc.description.wosFundingTextThe work in this paper is performed in the frame of an ESA GSTP project (ESA Contract No.: 4000122931/18/NL/LvH). The authors would like to thank Jason Furlong from PWB Interconnect Solutions and all members of the ESA PCB/SMT working group for their valuable insights and feedback.
dc.identifier.doi10.1007/s12567-021-00403-2
dc.identifier.issn1868-2502
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41960
dc.publisherSPRINGER WIEN
dc.source.beginpage101
dc.source.endpage112
dc.source.issue1
dc.source.journalCEAS SPACE JOURNAL
dc.source.numberofpages12
dc.source.volume15
dc.subject.keywordsRELIABILITY
dc.subject.keywordsMICROVIAS
dc.title

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

dc.typeJournal article
dspace.entity.typePublication
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