Publication:

Conformal electroless deposition on monolayers for TSV applications

Date

2013
Meeting abstract
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-0578-3422
cris.virtualsource.department543f9950-e045-4e77-8292-8ca26808ebf3
cris.virtualsource.orcid543f9950-e045-4e77-8292-8ca26808ebf3
dc.contributor.authorCervati, Michele
dc.contributor.authorCarnevali, Guido
dc.contributor.authorArmini, Silvia
dc.contributor.authorMagagnin, Luca
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-21T06:54:43Z
dc.date.available2021-10-21T06:54:43Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22118
dc.source.beginpage2366
dc.source.conference224th Meeting of the Electrochemical Society
dc.source.conferencedate26/10/2013
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Conformal electroless deposition on monolayers for TSV applications

dc.typeMeeting abstract
dspace.entity.typePublication
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