Publication:

Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses

Date

2008
Journal article
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-4645-3326
cris.virtualsource.department167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.orcid167f3fe9-5a33-4143-92b1-a1c815093eba
dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.accessioned2021-10-17T08:36:06Z
dc.date.available2021-10-17T08:36:06Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14079
dc.source.beginpage1947
dc.source.endpage1951
dc.source.issue10
dc.source.journalMicroelectronic Engineering
dc.source.volume85
dc.title

Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses

dc.typeJournal article
dspace.entity.typePublication
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