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Mechanical characterization of CuSn intermetallics for advanced flip-chip bonding

Date

2008
Proceedings Paper
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dc.contributor.authorZhang, Wenqi
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorRuythooren, Wouter
dc.date.accessioned2021-10-17T13:08:21Z
dc.date.available2021-10-17T13:08:21Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14837
dc.source.beginpage186
dc.source.conference41st International Symposium on Microelectronics
dc.source.conferencedate2/11/2008
dc.source.conferencelocationProvidence ,RI USA
dc.source.endpage189
dc.title

Mechanical characterization of CuSn intermetallics for advanced flip-chip bonding

dc.typeProceedings paper
dspace.entity.typePublication
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