Publication:

EOCB-platform for integrated Photonic chips direct-on-board assembly within Tb/s applications

Date

2018-05
Proceedings Paper
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cris.virtual.orcid0000-0002-9672-6652
cris.virtual.orcid0000-0001-8291-0339
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department3dada851-d554-4718-8993-44b5bf752bf5
cris.virtualsource.department39e0caac-a609-4260-9e90-0aede56a5501
cris.virtualsource.departmentd19807b8-200f-4c9b-b820-3e1d4d33801d
cris.virtualsource.orcid3dada851-d554-4718-8993-44b5bf752bf5
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cris.virtualsource.orcidd19807b8-200f-4c9b-b820-3e1d4d33801d
dc.contributor.authorLamprecht, T.
dc.contributor.authorBruderer, A.
dc.contributor.authorLambrecht, Joris
dc.contributor.authorRamon, Hannes
dc.contributor.authorPremerlani, R.
dc.contributor.authorYin, Xin
dc.contributor.authorBetschon, F.
dc.contributor.imecauthorLambrecht, Joris
dc.contributor.imecauthorRamon, Hannes
dc.contributor.imecauthorYin, Xin
dc.contributor.orcidimecLambrecht, Joris::0000-0001-8291-0339
dc.contributor.orcidimecYin, Xin::0000-0002-9672-6652
dc.date.accessioned2021-10-25T21:28:10Z
dc.date.available2021-10-25T21:28:10Z
dc.date.embargo9999-12-31
dc.date.issued2018-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31111
dc.source.beginpage854
dc.source.conferenceIEEE 68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage858
dc.title

EOCB-platform for integrated Photonic chips direct-on-board assembly within Tb/s applications

dc.typeProceedings paper
dspace.entity.typePublication
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