Publication:
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Date
| dc.contributor.author | Lanckmans, Filip | |
| dc.contributor.author | Brongersma, Sywert | |
| dc.contributor.author | Varga, Istvan | |
| dc.contributor.author | Bender, Hugo | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Brongersma, Sywert | |
| dc.contributor.imecauthor | Bender, Hugo | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T17:13:18Z | |
| dc.date.available | 2021-10-14T17:13:18Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5428 | |
| dc.source.beginpage | D1.4.1 | |
| dc.source.conference | Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics | |
| dc.source.conferencedate | 23/04/2000 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | D1.4.6 | |
| dc.title | A quantitative study of the adhesion between copper, barrier and organic low-k polymers | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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