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BGA electromigration behavior and why it has become the bottleneck

 
dc.contributor.authorLabie, Riet
dc.contributor.authorNawghane, Chinmay
dc.contributor.authorTsiakos, Dimitrios
dc.contributor.authorMertens, Jan
dc.contributor.authorTremble, Eric
dc.contributor.authorGraf, Richard
dc.contributor.authorSauter, Wolfgang
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.imecauthorTsiakos, Dimitrios
dc.contributor.imecauthorMertens, Jan
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimecTsiakos, Dimitrios::0000-0001-6992-8358
dc.contributor.orcidimecMertens, Jan::0000-0003-4674-6070
dc.date.accessioned2025-07-14T14:50:13Z
dc.date.available2025-07-14T14:50:13Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00111
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45906
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage678
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage684
dc.source.journalN/A
dc.source.numberofpages7
dc.title

BGA electromigration behavior and why it has become the bottleneck

dc.typeProceedings paper
dspace.entity.typePublication
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