Publication:
Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
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1894 since deposited on 2021-10-21
1last month
Acq. date: 2026-05-18
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Statistics
Views
1894 since deposited on 2021-10-21
1last month
Acq. date: 2026-05-18
Citations