Publication:

Lead free solder joint in electronic applications: material behaviour and reliability

Date

2010-01
Dissertation
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0009-0008-0641-0146
cris.virtualsource.department6e283418-c209-44e0-94dd-6efaba062f11
cris.virtualsource.orcid6e283418-c209-44e0-94dd-6efaba062f11
dc.contributor.authorLimaye, Paresh
dc.contributor.thesisadvisorVandepitte, Dirk
dc.contributor.thesisadvisorVerlinden, Albert
dc.date.accessioned2021-10-18T18:19:31Z
dc.date.available2021-10-18T18:19:31Z
dc.date.embargo9999-12-31
dc.date.issued2010-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17498
dc.title

Lead free solder joint in electronic applications: material behaviour and reliability

dc.typePHD thesis
dspace.entity.typePublication
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