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Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer

 
dc.contributor.authorPantano, Nicolas
dc.contributor.authorChery, Emmanuel
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-01-05T12:36:28Z
dc.date.available2022-09-17T02:52:06Z
dc.date.available2023-01-05T12:36:28Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00195
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40439
dc.publisherIEEE
dc.source.beginpage1218
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage1223
dc.source.journalna
dc.source.numberofpages6
dc.title

Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer

dc.typeProceedings paper
dspace.entity.typePublication
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