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Interposer technology for high-speed, high-density interconnects

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dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDetalle, Mikael
dc.contributor.authorSun, Xiao
dc.contributor.authorKim, Jaemin
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T18:11:48Z
dc.date.available2021-10-20T18:11:48Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21761
dc.source.conferenceGlobal Interposer Technology Workshop
dc.source.conferencedate14/11/2012
dc.source.conferencelocationAtlanta, GA USA
dc.title

Interposer technology for high-speed, high-density interconnects

dc.typeOral presentation
dspace.entity.typePublication
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