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Reduction of electrical crosstalk in hybrid backside illuminated CMOS imagers using deep trench isolation

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-9237-7862
cris.virtual.orcid0000-0002-4645-3326
cris.virtual.orcid0000-0003-0922-3860
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-7878-6977
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department8b6212e3-bdd8-4bad-8be0-eb156fa3dce8
cris.virtualsource.department167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.department3fc2a075-742b-4512-a346-99862df5a325
cris.virtualsource.department86e64d7e-ed53-486d-8e17-c392e0d52fb5
cris.virtualsource.department983a9133-4a21-4e3b-b2d6-de214d0ab0b9
cris.virtualsource.department181ca220-d460-4d98-bd99-7ac4192501b3
cris.virtualsource.orcid8b6212e3-bdd8-4bad-8be0-eb156fa3dce8
cris.virtualsource.orcid167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.orcid3fc2a075-742b-4512-a346-99862df5a325
cris.virtualsource.orcid86e64d7e-ed53-486d-8e17-c392e0d52fb5
cris.virtualsource.orcid983a9133-4a21-4e3b-b2d6-de214d0ab0b9
cris.virtualsource.orcid181ca220-d460-4d98-bd99-7ac4192501b3
dc.contributor.authorMinoglou, Kiki
dc.contributor.authorDe Munck, Koen
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorBorgers, Tom
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorBogaerts, Jan
dc.contributor.authorFicai Veltroni, Iacopo
dc.contributor.authorZayer, Igor
dc.contributor.authorMeynart, Roland
dc.contributor.authorBezy, Jean-Loup
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.date.accessioned2021-10-17T09:03:58Z
dc.date.available2021-10-17T09:03:58Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14171
dc.source.beginpage129
dc.source.conference1tth International Interconnect Technology Conference - IITC
dc.source.conferencedate2/06/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage131
dc.title

Reduction of electrical crosstalk in hybrid backside illuminated CMOS imagers using deep trench isolation

dc.typeProceedings paper
dspace.entity.typePublication
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