Publication:
A system level approach to a structured MCM design methodology
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtualsource.department | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.orcid | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| dc.contributor.author | Ringoot, Edwin | |
| dc.contributor.author | Truzzi, Claudio | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.date.accessioned | 2021-10-01T08:47:16Z | |
| dc.date.available | 2021-10-01T08:47:16Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 1998 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2902 | |
| dc.source.beginpage | 184 | |
| dc.source.conference | Proceedings 1998 International Conference on Multichip Modules and High Density Packaging | |
| dc.source.conferencedate | 15/04/1998 | |
| dc.source.conferencelocation | Denver, CO USA | |
| dc.source.endpage | 189 | |
| dc.title | A system level approach to a structured MCM design methodology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |