Publication:
Standardization requirements for 3D-TSV system integration
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-19T12:34:49Z | |
| dc.date.available | 2021-10-19T12:34:49Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18569 | |
| dc.source.conference | Semi SiP Global Summit 2011-3D IC Technology Forum | |
| dc.source.conferencedate | 8/09/2011 | |
| dc.source.conferencelocation | Taipei Taiwan | |
| dc.title | Standardization requirements for 3D-TSV system integration | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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