Publication:

Bonding on Cu: a new stress evaluation approach by Raman spectroscopy

Date

2002
Proceedings Paper
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dc.contributor.authorChen, Jian
dc.contributor.authorHo, Meng
dc.contributor.authorLam, Kan Wai
dc.contributor.authorRatchev, Petar
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorBeyne, Eric
dc.contributor.authorVath, C.J.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-14T21:13:56Z
dc.date.available2021-10-14T21:13:56Z
dc.date.embargo9999-12-31
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6102
dc.source.beginpage60
dc.source.conferenceProceedings 4th Electronics Packaging Technology Conference
dc.source.conferencedate10/12/2002
dc.source.conferencelocationSingapore
dc.source.endpage64
dc.title

Bonding on Cu: a new stress evaluation approach by Raman spectroscopy

dc.typeProceedings paper
dspace.entity.typePublication
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