Publication:

High-yield parallel transfer print integration of III-V substrate-illuminated C-band photodiodes on silicon photonic integrated circuits

Date

2019
Proceedings Paper
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dc.contributor.authorMuliuk, Grigorij
dc.contributor.authorZhang, Jing
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorCorbett, Brian
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.contributor.imecauthorMuliuk, Grigorij
dc.contributor.imecauthorZhang, Jing
dc.contributor.imecauthorGoyvaerts, Jeroen
dc.contributor.imecauthorKumari, Sulakshna
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecZhang, Jing::0000-0001-6608-9990
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.accessioned2021-10-27T14:27:48Z
dc.date.available2021-10-27T14:27:48Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33636
dc.identifier.urlhttps://doi.org/10.1117/12.2507373
dc.source.beginpage1092305
dc.source.conferenceProceedings of SPIE-Conference on Silicon Photonics XIV
dc.source.conferencedate4/02/2019
dc.source.conferencelocationSan Francisco USA
dc.title

High-yield parallel transfer print integration of III-V substrate-illuminated C-band photodiodes on silicon photonic integrated circuits

dc.typeProceedings paper
dspace.entity.typePublication
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