Publication:

Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

Date

2014
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorMoelans, Nele
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-22T04:05:47Z
dc.date.available2021-10-22T04:05:47Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24295
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813848&contentType=Conference+Publications
dc.source.beginpage1
dc.source.conference15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate7/04/2014
dc.source.conferencelocationGent Belgium
dc.source.endpage4
dc.title

Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions