Publication:
Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading
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1992 since deposited on 2021-10-24
3last month
Acq. date: 2025-12-17
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Metrics
Views
1992 since deposited on 2021-10-24
3last month
Acq. date: 2025-12-17
Citations