Publication:

Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

Date

2000
Proceedings Paper
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dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorCarchon, Geert
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T13:34:01Z
dc.date.available2021-10-14T13:34:01Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4660
dc.source.beginpage221
dc.source.conferenceProceedings Asia Pacific Microwave Conference
dc.source.conferencedate3/12/2000
dc.source.conferencelocationSydney Australia
dc.source.endpage224
dc.title

Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

dc.typeProceedings paper
dspace.entity.typePublication
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