Publication:
Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL
Date
| dc.contributor.author | Pantano, Nicolas | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Pantano, Nicolas | |
| dc.contributor.imecauthor | Slabbekoom, John | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2022-01-24T11:05:25Z | |
| dc.date.available | 2021-11-02T16:03:16Z | |
| dc.date.available | 2022-01-24T11:02:11Z | |
| dc.date.available | 2022-01-24T11:05:25Z | |
| dc.date.issued | 2020 | |
| dc.identifier.eisbn | 978-1-7281-6293-5 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38042 | |
| dc.publisher | IEEE | |
| dc.source.conference | 8th IEEE Electronics System-Integration Technology Conference (ESTC) | |
| dc.source.conferencedate | SEP 15-18, 2020 | |
| dc.source.conferencelocation | Vestfold | |
| dc.source.journal | na | |
| dc.source.numberofpages | 5 | |
| dc.title | Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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