Publication:

Development of a DRAM compatible Cu contact using self-aligned Ta-silicide and Ta-barrier

Date

2008
Presentation
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cris.virtual.orcid0000-0001-5490-0416
cris.virtual.orcid0000-0003-3545-3424
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.department5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.departmentce597ec5-f3fe-4966-abe1-6be960eae362
cris.virtualsource.orcid9f04b13f-f81c-4d48-a5bd-0b2cb5210392
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cris.virtualsource.orcidce597ec5-f3fe-4966-abe1-6be960eae362
dc.contributor.authorZhao, Chao
dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorAhn, J.Y.
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2021-10-17T13:11:41Z
dc.date.available2021-10-17T13:11:41Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14845
dc.source.conferenceMaterials for Advanced Metallization Workshop - MAM
dc.source.conferencedate2/03/2008
dc.source.conferencelocationDresden Germany
dc.title

Development of a DRAM compatible Cu contact using self-aligned Ta-silicide and Ta-barrier

dc.typeOral presentation
dspace.entity.typePublication
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