Publication:
Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits
Date
| dc.contributor.author | Haesevoets, Karel | |
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.author | Vereecken, Philippe | |
| dc.contributor.imecauthor | Haesevoets, Karel | |
| dc.contributor.imecauthor | Radisic, Alex | |
| dc.contributor.imecauthor | Vereecken, Philippe | |
| dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
| dc.date.accessioned | 2021-10-27T09:56:43Z | |
| dc.date.available | 2021-10-27T09:56:43Z | |
| dc.date.issued | 2019 | |
| dc.identifier.issn | 0013-4651 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33079 | |
| dc.identifier.url | http://jes.ecsdl.org/lookup/doi/10.1149/2.0721908jes | |
| dc.source.beginpage | D315 | |
| dc.source.endpage | D322 | |
| dc.source.issue | 8 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 166 | |
| dc.title | Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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