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Investigation of chemical mechanical planarization (CMP) and post-CMP cleanig for Molybdenum

Date

2019
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dc.contributor.authorHarada, Ken
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorTeugels, Lieve
dc.contributor.authorStruyf, Herbert
dc.contributor.imecauthorHarada, Ken
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.date.accessioned2021-10-27T10:04:06Z
dc.date.available2021-10-27T10:04:06Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33098
dc.source.conferenceInternational Interconnect Technology Confference 2019 (IITC/MAM)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.title

Investigation of chemical mechanical planarization (CMP) and post-CMP cleanig for Molybdenum

dc.typeOral presentation
dspace.entity.typePublication
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