ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q

dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Nawghane, Chinmay
dc.contributor.author	Labie, Riet
dc.contributor.author	Lauwaert, Ralph
dc.contributor.author	Werkhoven, Daniel
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Nawghane, Chinmay
dc.contributor.imecauthor	Labie, Riet
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Nawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimec	Labie, Riet::0000-0002-1401-1291
dc.date.accessioned	2023-01-19T12:41:51Z
dc.date.available	2022-12-01T03:12:27Z
dc.date.available	2023-01-19T12:41:51Z
dc.date.issued	2021
dc.identifier.doi	10.1115/IPACK2021-73456
dc.identifier.eisbn	978-0-7918-8550-5
dc.identifier.issn	na
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40807
dc.publisher	AMER SOC MECHANICAL ENGINEERS
dc.source.conference	ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
dc.source.conferencedate	OCT 26-28, 2021
dc.source.conferencelocation	Virtual
dc.source.journal	na
dc.source.numberofpages	10
dc.title	ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
dc.type	Proceedings paper
dspace.entity.type	Publication
Files
Publication available in collections:	Conference contributions

Date