Publication:
Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
Date
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| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-4374-4854 | |
| cris.virtual.orcid | 0009-0001-4603-8659 | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtual.orcid | 0000-0001-9978-3575 | |
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| cris.virtual.orcid | 0000-0002-4975-6672 | |
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| cris.virtualsource.orcid | 135ecef5-5469-4174-84c8-f0ee675911c3 | |
| dc.contributor.author | Guo, Wei | |
| dc.contributor.author | Karmarkar, Aditya | |
| dc.contributor.author | Xu, Xiaopeng | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Absil, Philippe | |
| dc.contributor.author | El Sayed, Karim | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Guo, Wei | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Absil, Philippe | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T19:32:49Z | |
| dc.date.available | 2021-10-22T19:32:49Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25346 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159723 | |
| dc.source.beginpage | 1038 | |
| dc.source.conference | IEEE 65th Electronic Components & Technology Conference - ECTC | |
| dc.source.conferencedate | 2/05/2015 | |
| dc.source.conferencelocation | San Diego, CA USA | |
| dc.source.endpage | 1044 | |
| dc.title | Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |