Publication:

Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

Date

2015
Proceedings Paper
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dc.contributor.authorGuo, Wei
dc.contributor.authorKarmarkar, Aditya
dc.contributor.authorXu, Xiaopeng
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorGonzalez, Mario
dc.contributor.authorAbsil, Philippe
dc.contributor.authorEl Sayed, Karim
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T19:32:49Z
dc.date.available2021-10-22T19:32:49Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25346
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159723
dc.source.beginpage1038
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate2/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage1044
dc.title

Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

dc.typeProceedings paper
dspace.entity.typePublication
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