Publication:
Reliabilty challenges of 3D-stacked ICs
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-18T15:55:18Z | |
| dc.date.available | 2021-10-18T15:55:18Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16985 | |
| dc.source.conference | SEMICON Japan | |
| dc.source.conferencedate | 1/12/2010 | |
| dc.source.conferencelocation | Tokyo Japan | |
| dc.title | Reliabilty challenges of 3D-stacked ICs | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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