Publication:

A novel methodology for sensing the breakdown location and its application to the reliability study of ultra-thin Hf-silicate gate dielectrics

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

1937 since deposited on 2021-10-16
Acq. date: 2025-10-23

Citations

Metrics

Views

1937 since deposited on 2021-10-16
Acq. date: 2025-10-23

Citations