Publication:

Packaging of opto-electronic devices for flexible applications

Date

2010
Proceedings Paper
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cris.virtual.orcid0000-0001-8574-1235
cris.virtual.orcid0000-0002-3470-620X
cris.virtual.orcid0000-0003-0557-7741
cris.virtualsource.department846d8fc0-f203-4ef5-be37-a5353cf001c3
cris.virtualsource.department9b42d0bc-60bf-45a2-a3b2-a257fa194a38
cris.virtualsource.department419e6158-2400-4361-a474-404554955c35
cris.virtualsource.orcid846d8fc0-f203-4ef5-be37-a5353cf001c3
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cris.virtualsource.orcid419e6158-2400-4361-a474-404554955c35
dc.contributor.authorBosman, Erwin
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorVan Daele, Peter
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Daele, Peter
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Daele, Peter::0000-0003-0557-7741
dc.date.accessioned2021-10-18T15:24:31Z
dc.date.available2021-10-18T15:24:31Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16783
dc.source.beginpage76070G
dc.source.conferenceOptoelectronic Interconnects and Component Integration IX
dc.source.conferencedate25/01/2010
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Packaging of opto-electronic devices for flexible applications

dc.typeProceedings paper
dspace.entity.typePublication
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