Publication:
Novel interconnection processes for low cost PEN/PET substrates
Date
| dc.contributor.author | van den Brand, Jeroen | |
| dc.contributor.author | Kusters, Roel | |
| dc.contributor.author | Fledderus, Henri | |
| dc.contributor.author | Rubingh, Eric-Jan | |
| dc.contributor.author | Podprocky, Tomas | |
| dc.contributor.author | Dietzel, Andreas | |
| dc.date.accessioned | 2021-10-18T04:01:10Z | |
| dc.date.available | 2021-10-18T04:01:10Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16366 | |
| dc.source.conference | 17th European Microelectronics and Packaging Conference & Exhibition - EMPC | |
| dc.source.conferencedate | 15/06/2009 | |
| dc.source.conferencelocation | Rimini Italy | |
| dc.title | Novel interconnection processes for low cost PEN/PET substrates | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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