Publication:

Process development to enable die sorting and 3D IC stacking

Date

2012-12
Proceedings Paper
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dc.contributor.authorLa Manna, Antonio
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T12:28:34Z
dc.date.available2021-10-20T12:28:34Z
dc.date.issued2012-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20973
dc.source.conference14th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate5/12/2012
dc.source.conferencelocationSingapore
dc.title

Process development to enable die sorting and 3D IC stacking

dc.typeProceedings paper
dspace.entity.typePublication
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