Publication:

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Date

2014
Proceedings Paper
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dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGerets, Carine
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T08:10:11Z
dc.date.available2021-10-22T08:10:11Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24804
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962710
dc.source.beginpage1
dc.source.conference5th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finlan
dc.source.endpage5
dc.title

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

dc.typeProceedings paper
dspace.entity.typePublication
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