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Surface contamination and electrical damage by focused ion beam: conditions applicable to the extraction of TEM lamellae from nano-electronic devices

Date

2015
Journal article
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dc.contributor.authorBender, Hugo
dc.contributor.authorFranquet, Alexis
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorParmentier, Brigitte
dc.contributor.authorClarysse, Trudo
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorKwakman, Laurens
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorParmentier, Brigitte
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.date.accessioned2021-10-22T18:32:44Z
dc.date.available2021-10-22T18:32:44Z
dc.date.issued2015
dc.identifier.issn0268-1242
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24983
dc.identifier.urlhttp://iopscience.iop.org/article/10.1088/0268-1242/30/11/114015
dc.source.beginpage114015
dc.source.issue11
dc.source.journalSemiconductor Science and Technology
dc.source.volume30
dc.title

Surface contamination and electrical damage by focused ion beam: conditions applicable to the extraction of TEM lamellae from nano-electronic devices

dc.typeJournal article
dspace.entity.typePublication
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