Publication:

Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution

Date

2019
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-1086-270X
cris.virtual.orcid0000-0002-2322-8070
cris.virtualsource.departmentf9ae71b7-6a7c-4af7-9261-89511f8785c1
cris.virtualsource.departmentc6866b45-32ff-4b7e-92ca-75784134615c
cris.virtualsource.orcidf9ae71b7-6a7c-4af7-9261-89511f8785c1
cris.virtualsource.orcidc6866b45-32ff-4b7e-92ca-75784134615c
dc.contributor.authorSufrin, Yael
dc.contributor.authorLeray, Philippe
dc.contributor.authorCanga, Eren
dc.contributor.authorCohen, Avi
dc.contributor.authorDmitriev, Vladimir
dc.contributor.authorGorhad, Kujan
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorCanga, Eren
dc.contributor.orcidimecCanga, Eren::0000-0002-2322-8070
dc.date.accessioned2021-10-27T19:09:57Z
dc.date.available2021-10-27T19:09:57Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34080
dc.identifier.urlhttps://doi.org/10.1117/12.2535641
dc.source.beginpage111770J
dc.source.conference35th European Mask and Lithography Conference (EMLC 2019)
dc.source.conferencedate24/02/2019
dc.source.conferencelocationDresden Germany
dc.title

Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution

dc.typeProceedings paper
dspace.entity.typePublication
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