Publication:

3D system integration technologies

Date

2007
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-3096-050X
cris.virtual.orcid0000-0002-6878-7124
cris.virtualsource.department67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.department9156bc37-ce4f-400b-8108-5ac33a3650ac
cris.virtualsource.orcid67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.orcid9156bc37-ce4f-400b-8108-5ac33a3650ac
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T15:05:33Z
dc.date.available2021-10-16T15:05:33Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11742
dc.source.beginpage180
dc.source.conferenceIEEE International Conference on Integrated Circuit Design and Technology - ICICDT
dc.source.conferencedate30/05/2007
dc.source.conferencelocationAustin, TX USA
dc.source.endpage182
dc.title

3D system integration technologies

dc.typeProceedings paper
dspace.entity.typePublication
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