Publication:

Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects

Date

2023
Journal article
https://doi.org/10.1109/TED.2023.3287168
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dc.contributor.authorFang, Yu
dc.contributor.authorCiofi, Ivan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorDegraeve, Robin
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorFang, Yu
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecFang, Yu::0000-0002-9442-524X
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2023-11-27T07:55:33Z
dc.date.available2023-08-02T17:18:14Z
dc.date.available2023-11-27T07:55:33Z
dc.date.issued2023
dc.identifier.doi10.1109/TED.2023.3287168
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42253
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage4332
dc.source.endpage4337
dc.source.issue18
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages6
dc.source.volume70
dc.title

Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects

dc.typeJournal article
dspace.entity.typePublication
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