Publication:

Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects

Date

2020
Journal article
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dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorLi, Yunlong
dc.contributor.authorStucchi, Michele
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-28T22:50:49Z
dc.date.available2021-10-28T22:50:49Z
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35317
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9157942
dc.source.beginpage1542
dc.source.endpage1551
dc.source.issue9
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume10
dc.title

Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects

dc.typeJournal article
dspace.entity.typePublication
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